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By John G. Webster (Editor)

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Modeling Refraction Characteristics of Silicon Nitride Film Deposited in a SiH/sub 4/-NH/sub 3/-N/sub 2/ Plasma Using Neural Network. IEEE Trans. Plasma Sci. 2003, 31, pp 317–323. 32. Wang, X. ; Mahajan, R. L. Artificial Neural Network ModelBased Run-to-Run Process Controller. IEEE Trans. Components, Packaging, Manufactur. Technol. C 1996, 19, pp 19– 26. 33. Han, S. ; May, G. ; Rohatgi, A. Modeling the Growth of PECVD Silicon Nitride Films for Solar Cell Applications Using Neural Networks. IEEE Trans.

2002, 15, pp 71–78. 35. Salam, F. ; Asmussen, J. Modeling of a Plasma Processing Machine for Semiconductor Wafer Etching Using Energy-Functions-Based Neural Networks. IEEE Trans. Control Syst. Technol. 1997, 5, pp 598– 613. 36. ; May, G. S. Reactive Ion Etch Modeling Using Neural Networks and Simulated Annealing. IEEE Trans. Components, Packaging, Manufactur. Technol. C 1996, 19, pp 3–8. 37. ; Kwon, K. Modeling Magnetically Enhanced RIE of Aluminum Alloy Films Using Neural Networks. IEEE Trans.

26. ; Domenech, S. A Fuzzy Simulation Model for Production Control in a Semiconductor Wafer Manufacturing. Proc. 3rd IEEE Conf. Cont. ; 1994. 27. -H. Fault Detection and Isolation for Plasma Etching Using Model-based Approach. Proc. IEEE/SEMI Adv. Semic. Manufac. Conf. Workshop; 2003. 28. ; May, G. S. Run-to-Run Failure Detection and Diagnosis Using Neural Networks and Dempster-Shafer Theory: An Application to Excimer Laser Ablation. IEEE Trans. Electron. Packaging Manufactur. 2006, 29, pp 42–49.

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